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Semiconductor Processing Tools
silicon wafer grinding wheel, grinding wheel, silicon wafer wheel
silicon wafer grinding wheel, grinding wheel, silicon wafer wheel
Product Details:
| Type | Abrasive Pad |
|---|---|
| Place of Origin | Fujian, China (Mainland) |
| Brand Name | Chiaping, best |
| Model Number | 6A9 |
Payment & Shipping Terms:
| Minimum Order Quantity: | 1 Piece/Pieces |
|---|---|
| Price: | FOB Xiamen USD 218~365 |
| Delivery Time: | Within 7 days after received payment |
| Payment Terms: | T/T |
| Supply Ability: | 300 Piece/Pieces per Week |
Detailed Product Description
Features of Silicon wafer grinding wheel :
1) longer wheel life , extremly low depth of sub-surface damage
2) reduced wheel dressing , reduced grinding resistance locatization, cost dow
silicon wafer grinding wheel, grinding wheel, silicon wafer wheel
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Company Info
Xiamen Chiaping Diamond Industrial Co., Ltd.
[China (Mainland)]
[Verified Member]
City: Xiamen
Province/State: Fujian
Country/Region : China (Mainland)
Business Type:Manufacturer
Online Postings: Products